Yang Xie, Chongxi Bao, Caleb Serafy, Tiantao Lu, Ankur Srivastava, Mark Tehranipoor. Security and Vulnerability Implications of 3D ICs. IEEE Trans. Multi-Scale Computing Systems, 2(2):108-122, 2016. [doi]
@article{XieBSLST16,
title = {Security and Vulnerability Implications of 3D ICs},
author = {Yang Xie and Chongxi Bao and Caleb Serafy and Tiantao Lu and Ankur Srivastava and Mark Tehranipoor},
year = {2016},
doi = {10.1109/TMSCS.2016.2550460},
url = {http://doi.ieeecomputersociety.org/10.1109/TMSCS.2016.2550460},
researchr = {https://researchr.org/publication/XieBSLST16},
cites = {0},
citedby = {0},
journal = {IEEE Trans. Multi-Scale Computing Systems},
volume = {2},
number = {2},
pages = {108-122},
}