A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending - researchr publication authors

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Leon Xu, Tommi Reinikainen, Wei Ren, Bo Ping Wang, Zhenxue Han, Dereje Agonafer. A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending. Microelectronics Reliability, 44(12):1977-1983, 2004. [doi]

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