Using active thermography for defects inspection of flip chip

Zhensong Xu, Tielin Shi, Xiangning Lu, Guanglan Liao. Using active thermography for defects inspection of flip chip. Microelectronics Reliability, 54(4):808-815, 2014. [doi]

Authors

Zhensong Xu

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Tielin Shi

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Xiangning Lu

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Guanglan Liao

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