Accurate System-level TSV-to-TSV Capacitive Coupling Fault Model for 3D-NoC

Pooria M. Yaghini, Ashkan Eghbal, Siavash S. Yazdi, Nader Bagherzadeh. Accurate System-level TSV-to-TSV Capacitive Coupling Fault Model for 3D-NoC. In André Ivanov, Diana Marculescu, Partha Pratim Pande, José Flich, Karthik Pattabiraman, editors, Proceedings of the 9th International Symposium on Networks-on-Chip, NOCS 2015, Vancouver, BC, Canada, September 28-30, 2015. ACM, 2015. [doi]

@inproceedings{YaghiniEYB15,
  title = {Accurate System-level TSV-to-TSV Capacitive Coupling Fault Model for 3D-NoC},
  author = {Pooria M. Yaghini and Ashkan Eghbal and Siavash S. Yazdi and Nader Bagherzadeh},
  year = {2015},
  doi = {10.1145/2786572.2786598},
  url = {http://doi.acm.org/10.1145/2786572.2786598},
  researchr = {https://researchr.org/publication/YaghiniEYB15},
  cites = {0},
  citedby = {0},
  booktitle = {Proceedings of the 9th International Symposium on Networks-on-Chip, NOCS 2015, Vancouver, BC, Canada, September 28-30, 2015},
  editor = {André Ivanov and Diana Marculescu and Partha Pratim Pande and José Flich and Karthik Pattabiraman},
  publisher = {ACM},
  isbn = {978-1-4503-3396-2},
}