Passive Modeling of Interconnects by Waveform Shaping - researchr publication related

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Boyuan Yan, Pu Liu, Sheldon X.-D. Tan, Bruce McGaughy. Passive Modeling of Interconnects by Waveform Shaping. In 8th International Symposium on Quality of Electronic Design (ISQED 2007), 26-28 March 2007, San Jose, CA, USA. pages 356-361, IEEE Computer Society, 2007. [doi]

The following publications are possibly variants of this publication:

Passive Reduced-Order Macro-Modeling for Linear Time-Delay Interconnect SystemsWenliang Tseng, Chien-Nan Jimmy Liu, Chauchin Su. ieicet, 89-C(11):1713-1718, 2006. [doi]

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