Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee. Chip warpage model for reliability prediction of delamination failures. Microelectronics Reliability, 52(4):718-724, 2012. [doi]
@article{YangKL12-2,
title = {Chip warpage model for reliability prediction of delamination failures},
author = {Se Young Yang and Woon-Seong Kwon and Soon-Bok Lee},
year = {2012},
doi = {10.1016/j.microrel.2011.11.013},
url = {http://dx.doi.org/10.1016/j.microrel.2011.11.013},
researchr = {https://researchr.org/publication/YangKL12-2},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {4},
pages = {718-724},
}