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Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition

S. Y. Yang, W. J. Lee, S. H. Jeong, S. J. Lee. Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition. Microelectronics Reliability, 46(9-11):1904-1909, 2006. [doi]

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S. Y. Yang

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W. J. Lee

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S. H. Jeong

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S. J. Lee

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