Esther Wai Ching Yau, Jing Feng Gong, Philip Chan. Al surface morphology effect on flip-chip solder bump shear strength. Microelectronics Reliability, 44(2):323-331, 2004. [doi]
@article{YauGC04,
title = {Al surface morphology effect on flip-chip solder bump shear strength},
author = {Esther Wai Ching Yau and Jing Feng Gong and Philip Chan},
year = {2004},
doi = {10.1016/S0026-2714(03)00159-8},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00159-8},
researchr = {https://researchr.org/publication/YauGC04},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {44},
number = {2},
pages = {323-331},
}