Measurement of high electrical current density effects in solder joints

Hua Ye, Douglas C. Hopkins, Cemal Basaran. Measurement of high electrical current density effects in solder joints. Microelectronics Reliability, 43(12):2021-2029, 2003. [doi]

Authors

Hua Ye

This author has not been identified. Look up 'Hua Ye' in Google

Douglas C. Hopkins

This author has not been identified. Look up 'Douglas C. Hopkins' in Google

Cemal Basaran

This author has not been identified. Look up 'Cemal Basaran' in Google