Taeshik Yoon, Inhwa Lee, Taek-Soo Kim. Mechanical reliability of Cu/low-k interconnects and underfill. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]
@inproceedings{YoonLK11-4, title = {Mechanical reliability of Cu/low-k interconnects and underfill}, author = {Taeshik Yoon and Inhwa Lee and Taek-Soo Kim}, year = {2011}, doi = {10.1109/3DIC.2012.6263001}, url = {http://dx.doi.org/10.1109/3DIC.2012.6263001}, researchr = {https://researchr.org/publication/YoonLK11-4}, cites = {0}, citedby = {0}, pages = {1-4}, booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012}, editor = {Mitsumasa Koyanagi and Morihiro Kada}, publisher = {IEEE}, isbn = {978-1-4673-2189-1}, }