Yang Yu, Zhiming Yang, Kangkang Xu. A Post-Bond TSVs Test Solution for Leakage Fault. In IEEE International Test Conference in Asia, ITC-Asia 2019, Tokyo, Japan, September 3-5, 2019. pages 127-132, IEEE, 2019. [doi]
@inproceedings{YuYX19-0,
title = {A Post-Bond TSVs Test Solution for Leakage Fault},
author = {Yang Yu and Zhiming Yang and Kangkang Xu},
year = {2019},
doi = {10.1109/ITC-Asia.2019.00035},
url = {https://doi.org/10.1109/ITC-Asia.2019.00035},
researchr = {https://researchr.org/publication/YuYX19-0},
cites = {0},
citedby = {0},
pages = {127-132},
booktitle = {IEEE International Test Conference in Asia, ITC-Asia 2019, Tokyo, Japan, September 3-5, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4718-5},
}