Mohammad Yunus, K. Srihari, J. M. Pitarresi, Anthony Primavera. Effect of voids on the reliability of BGA/CSP solder joints. Microelectronics Reliability, 43(12):2077-2086, 2003. [doi]
@article{YunusSPP03,
title = {Effect of voids on the reliability of BGA/CSP solder joints},
author = {Mohammad Yunus and K. Srihari and J. M. Pitarresi and Anthony Primavera},
year = {2003},
doi = {10.1016/S0026-2714(03)00124-0},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00124-0},
tags = {reliability},
researchr = {https://researchr.org/publication/YunusSPP03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {12},
pages = {2077-2086},
}