Jianping Zeng, Hongjune Kim, Jaejin Lee, Changhee Jung. Turnpike: Lightweight Soft Error Resilience for In-Order Cores. In MICRO '21: 54th Annual IEEE/ACM International Symposium on Microarchitecture, Virtual Event, Greece, October 18-22, 2021. pages 654-666, ACM, 2021. [doi]
@inproceedings{ZengKLJ21,
title = {Turnpike: Lightweight Soft Error Resilience for In-Order Cores},
author = {Jianping Zeng and Hongjune Kim and Jaejin Lee and Changhee Jung},
year = {2021},
doi = {10.1145/3466752.3480042},
url = {https://doi.org/10.1145/3466752.3480042},
researchr = {https://researchr.org/publication/ZengKLJ21},
cites = {0},
citedby = {0},
pages = {654-666},
booktitle = {MICRO '21: 54th Annual IEEE/ACM International Symposium on Microarchitecture, Virtual Event, Greece, October 18-22, 2021},
publisher = {ACM},
isbn = {978-1-4503-8557-2},
}