Guang Zeng, Stuart D. McDonald, Kazuhiro Nogita. Development of high-temperature solders: Review. Microelectronics Reliability, 52(7):1306-1322, 2012. [doi]
@article{ZengMN12,
title = {Development of high-temperature solders: Review},
author = {Guang Zeng and Stuart D. McDonald and Kazuhiro Nogita},
year = {2012},
doi = {10.1016/j.microrel.2012.02.018},
url = {http://dx.doi.org/10.1016/j.microrel.2012.02.018},
researchr = {https://researchr.org/publication/ZengMN12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {7},
pages = {1306-1322},
}