Exploring Phase Change Memory and 3D Die-Stacking for Power/Thermal Friendly, Fast and Durable Memory Architectures

Wangyuan Zhang, Tao Li. Exploring Phase Change Memory and 3D Die-Stacking for Power/Thermal Friendly, Fast and Durable Memory Architectures. In PACT 2009, Proceedings of the 18th International Conference on Parallel Architectures and Compilation Techniques, 12-16 September 2009, Raleigh, North Carolina, USA. pages 101-112, IEEE Computer Society, 2009. [doi]

@inproceedings{ZhangL09-26,
  title = {Exploring Phase Change Memory and 3D Die-Stacking for Power/Thermal Friendly, Fast and Durable Memory Architectures},
  author = {Wangyuan Zhang and Tao Li},
  year = {2009},
  doi = {10.1109/PACT.2009.30},
  url = {http://doi.ieeecomputersociety.org/10.1109/PACT.2009.30},
  tags = {architecture},
  researchr = {https://researchr.org/publication/ZhangL09-26},
  cites = {0},
  citedby = {0},
  pages = {101-112},
  booktitle = {PACT 2009, Proceedings of the 18th International Conference on Parallel Architectures and Compilation Techniques, 12-16 September 2009, Raleigh, North Carolina, USA},
  publisher = {IEEE Computer Society},
  isbn = {978-0-7695-3771-9},
}