A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications - researchr publication authors

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Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong. A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]

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