Z. Zhao. Thermal design of a broadband communication system with detailed modeling of TBGA packages. Microelectronics Reliability, 43(5):785-793, 2003. [doi]
@article{Zhao03,
title = {Thermal design of a broadband communication system with detailed modeling of TBGA packages},
author = {Z. Zhao},
year = {2003},
doi = {10.1016/S0026-2714(03)00029-5},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00029-5},
tags = {modeling, design},
researchr = {https://researchr.org/publication/Zhao03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {5},
pages = {785-793},
}