Quanwu Zhao, Kewei Tan, Jianhui Du, Tom Van Woensel. Joint case pack size and unpacking location optimization in a retail supply chain including product returns. Computers & Industrial Engineering, 182:109415, August 2023. [doi]
@article{ZhaoTDW23,
title = {Joint case pack size and unpacking location optimization in a retail supply chain including product returns},
author = {Quanwu Zhao and Kewei Tan and Jianhui Du and Tom Van Woensel},
year = {2023},
month = {August},
doi = {10.1016/j.cie.2023.109415},
url = {https://doi.org/10.1016/j.cie.2023.109415},
researchr = {https://researchr.org/publication/ZhaoTDW23},
cites = {0},
citedby = {0},
journal = {Computers & Industrial Engineering},
volume = {182},
pages = {109415},
}