Zimu Zheng, Yimin Dai, Dan Wang. DUET: Towards a Portable Thermal Comfort Model. In Proceedings of the 6th ACM International Conference on Systems for Energy-Efficient Buildings, Cities, and Transportation, BuildSys 2019, New York, NY, USA, November 13-14, 2019. pages 51-60, ACM, 2019. [doi]
@inproceedings{ZhengDW19-0,
title = {DUET: Towards a Portable Thermal Comfort Model},
author = {Zimu Zheng and Yimin Dai and Dan Wang},
year = {2019},
doi = {10.1145/3360322.3360842},
url = {https://doi.org/10.1145/3360322.3360842},
researchr = {https://researchr.org/publication/ZhengDW19-0},
cites = {0},
citedby = {0},
pages = {51-60},
booktitle = {Proceedings of the 6th ACM International Conference on Systems for Energy-Efficient Buildings, Cities, and Transportation, BuildSys 2019, New York, NY, USA, November 13-14, 2019},
publisher = {ACM},
isbn = {978-1-4503-7005-9},
}