Tao Zheng, Meng Huang, Yi Liu, Xiaoming Zha. Reliability model of bond wire fatigue for IGBT in MMC with system redundancy consideration. Microelectronics Reliability, 88:1164-1167, 2018. [doi]
@article{ZhengHLZ18,
title = {Reliability model of bond wire fatigue for IGBT in MMC with system redundancy consideration},
author = {Tao Zheng and Meng Huang and Yi Liu and Xiaoming Zha},
year = {2018},
doi = {10.1016/j.microrel.2018.07.099},
url = {https://doi.org/10.1016/j.microrel.2018.07.099},
researchr = {https://researchr.org/publication/ZhengHLZ18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {88},
pages = {1164-1167},
}