Jiang Zhou. Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling method. Microelectronics Reliability, 48(6):805-810, 2008. [doi]
@article{Zhou08-7,
title = {Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling method},
author = {Jiang Zhou},
year = {2008},
doi = {10.1016/j.microrel.2008.03.027},
url = {http://dx.doi.org/10.1016/j.microrel.2008.03.027},
tags = {modeling, analysis},
researchr = {https://researchr.org/publication/Zhou08-7},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {48},
number = {6},
pages = {805-810},
}