Electromigration reliability of open TSV structures

Wolfhard H. Zisser, Hajdin Ceric, Josef Weinbub, Siegfried Selberherr. Electromigration reliability of open TSV structures. Microelectronics Reliability, 54(9-10):2133-2137, 2014. [doi]

Authors

Wolfhard H. Zisser

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Hajdin Ceric

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Josef Weinbub

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Siegfried Selberherr

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