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Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies

Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi. Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. Microelectronics Reliability, 78:233-242, 2017. [doi]

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