Paris Avgeriou, Klaus Schmid, editors, Proceedings of the Second International Conference on Technical Debt, TechDebt@ICSE 2019, Montreal, QC, Canada, May 26-27, 2019. IEEE / ACM, 2019. [doi]
Conference: ICSE2019
@proceedings{icse-2019techdebt,
title = {Proceedings of the Second International Conference on Technical Debt, TechDebt@ICSE 2019, Montreal, QC, Canada, May 26-27, 2019},
year = {2019},
url = {https://dl.acm.org/citation.cfm?id=3355321},
researchr = {https://researchr.org/publication/icse-2019techdebt},
cites = {0},
citedby = {0},
booktitle = {Proceedings of the Second International Conference on Technical Debt, TechDebt@ICSE 2019, Montreal, QC, Canada, May 26-27, 2019},
conference = {ICSE},
editor = {Paris Avgeriou and Klaus Schmid},
publisher = {IEEE / ACM},
}