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Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices

Myeong-Hyeok Jeong, Jae-Won Kim, Byung-Hyun Kwak, Young-Bae Park, Byoung-Joon Kim, Young-Chang Joo. Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. In Pedro Vieira, Ana L. N. Fred, Joaquim Filipe, Hugo Gamboa, editors, BIODEVICES 2011 - Proceedings of the International Conference on Biomedical Electronics and Devices, Rome, Italy, 26-29 January, 2011. pages 311-314, SciTePress, 2011.

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