Co-design of signal, power, and thermal distribution networks for 3D ICs

Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad Bakir, Yogendra Joshi, Andrei Fedorov, Sung Kyu Lim. Co-design of signal, power, and thermal distribution networks for 3D ICs. In Design, Automation and Test in Europe, DATE 2009, Nice, France, April 20-24, 2009. pages 610-615, IEEE, 2009. [doi]

Abstract

Abstract is missing.