Mostafa Said, Farhad Mehdipour, Mohamed El-Sayed. Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias. In 2013 Euromicro Conference on Digital System Design, DSD 2013, Los Alamitos, CA, USA, September 4-6, 2013. pages 925-932, IEEE, 2013. [doi]
Abstract is missing.