Cristiano Santos, Pascal Vivet, Ricardo Augusto da Luz Reis. Thermal impact of 3D stacking and die thickness: Analysis and characterization of a memory-on-logic 3D circuit. In 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014, Marseille, France, December 7-10, 2014. pages 718-721, IEEE, 2014. [doi]
Abstract is missing.