Ong Tee Say - researchr alias

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Viewing Publication 1 - 4 from 4

2013

Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free SolderVithyacharan Retnasamy, Zaliman Sauli, Nurul Izza Mohd Nor, Moganraj Palianysamy, Rizalafande Che Ismail, Ong Tee Say, Hussin Kamarudin. uksim 2013: 317-320 [doi]

Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF MethodZaliman Sauli, Vithyacharan Retnasamy, Muhamad Hafiz Ab Aziz, Ong Tee Say, Hussin Kamarudin, Dasarathan Rajan Theren, Bahari Man. uksim 2013: 314-316 [doi]

Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder BallZaliman Sauli, Vithyacharan Retnasamy, Ong Tee Say, Steven Taniselass, Rizalafande Che Ismail, Aaron Koay Terr Yeow, Hussin Kamarudin. uksim 2013: 321-324 [doi]

5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LEDRajendaran Vairavan, Zaliman Sauli, Vithyacharan Retnasamy, Phaklen EhKan, Ong Tee Say. asiams 2013: 78-81 [doi]

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