Abstract is missing.
- Chiplet Set For Artificial IntelligenceJoshua A. Stevens, Tse-Han Pan, Prasanth Prabu Ravichandiran, Paul D. Franzon. 1-5 [doi]
- Fast, Accurate Assembly-Level Physical Verification of 3DIC PackagesNermeen Hossam, John Ferguson. 1-4 [doi]
- Review of Hybrid Integration Techniques for Integrating III-V Onta SiliconErik W. Masselink, Andrew Stark, Benjamin B. Yang, T. Robert Harris. 1-7 [doi]
- Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVsMohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic. 1-4 [doi]
- Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based PackagesPo-Yao Chuang, Francesco Lorenzelli, Sreejit Chakravarty, Slimane Boutobza, Cheng-Wen Wu, Georges G. E. Gielen, Erik Jan Marinissen. 1-6 [doi]
- A Study on a Tether-Less Approach Towards Micro-Transfer-Printing of Large-Footprint Power Micro-Inductor ChipletsSomnath Pal, Liang Ye, James O'Callaghan, Fatih Bilge Atar, Cian O'Mathuna, Brian Corbett, Ranajit Sai, Sambuddha Khan. 1-4 [doi]
- Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-lastJiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima. 1-4 [doi]
- Measurement Point Selection Algorithms for Testing Power TSVsKoutaro Hachiya. 1-4 [doi]
- Thermal Estimation for 3D-ICs Through Generative NetworksPriyank Kashyap, Prasanth Prabu Ravichandiran, Lee Wang, Dror Baron, Chau-Wai Wong, Tianfu Wu 0001, Paul D. Franzon. 1-4 [doi]
- Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power PackagePouria Zaghari, Sourish S. Sinha, Jong Eun Ryu, Paul D. Franzon, Douglas C. Hopkins. 1-5 [doi]
- Copper Electrode Surface Features and Cu-SiO2Hybrid BondingMariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima. 1-4 [doi]
- SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor ApplicationsEmre Can Durmaz, Carl Heine, Zhibo Cao, Jens Lehmann 0002, Dietmar Kissinger, Matthias Wietstruck. 1-4 [doi]