Abrar Abdurrob, Emre Salman, Jack Lombardi. Thermal Integrity of ReRAM-based Near-Memory Computing in 3D Integrated DNN Accelerators. In Jürgen Becker 0001, Andrew Marshall, Tanja Harbaum, Amlan Ganguly, Fahad Siddiqui, Kieran McLaughlin, editors, 36th IEEE International System-on-Chip Conference, SOCC 2023, Santa Clara, CA, USA, September 5-8, 2023. pages 1-6, IEEE, 2023. [doi]
@inproceedings{AbdurrobSL23,
title = {Thermal Integrity of ReRAM-based Near-Memory Computing in 3D Integrated DNN Accelerators},
author = {Abrar Abdurrob and Emre Salman and Jack Lombardi},
year = {2023},
doi = {10.1109/SOCC58585.2023.10256927},
url = {https://doi.org/10.1109/SOCC58585.2023.10256927},
researchr = {https://researchr.org/publication/AbdurrobSL23},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {36th IEEE International System-on-Chip Conference, SOCC 2023, Santa Clara, CA, USA, September 5-8, 2023},
editor = {Jürgen Becker 0001 and Andrew Marshall and Tanja Harbaum and Amlan Ganguly and Fahad Siddiqui and Kieran McLaughlin},
publisher = {IEEE},
isbn = {979-8-3503-0011-6},
}