Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip - researchr publication authors

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Vladimir Afonso, Altamiro Amadeu Susin, Luan Audibert, Mário Saldanha, Ruhan Conceicao, Marcelo Schiavon Porto, Bruno Zatt, Luciano Volcan Agostini. Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip. In IEEE International Symposium on Circuits and Systems, ISCAS 2017, Baltimore, MD, USA, May 28-31, 2017. pages 1-4, IEEE, 2017. [doi]

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