Temperature-gradient based test scheduling for 3D stacked ICs

Nima Aghaee, Zebo Peng, Petru Eles. Temperature-gradient based test scheduling for 3D stacked ICs. In 20th IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2013, Abu Dhabi, December 8-11, 2013. pages 405-408, IEEE, 2013. [doi]

Abstract

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