An integrated temperature-cycling acceleration and test technique for 3D stacked ICs

Nima Aghaee, Zebo Peng, Petru Eles. An integrated temperature-cycling acceleration and test technique for 3D stacked ICs. In The 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015, Chiba, Japan, January 19-22, 2015. pages 526-531, IEEE, 2015. [doi]

@inproceedings{AghaeePE15,
  title = {An integrated temperature-cycling acceleration and test technique for 3D stacked ICs},
  author = {Nima Aghaee and Zebo Peng and Petru Eles},
  year = {2015},
  doi = {10.1109/ASPDAC.2015.7059060},
  url = {http://dx.doi.org/10.1109/ASPDAC.2015.7059060},
  researchr = {https://researchr.org/publication/AghaeePE15},
  cites = {0},
  citedby = {0},
  pages = {526-531},
  booktitle = {The 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015, Chiba, Japan, January 19-22, 2015},
  publisher = {IEEE},
  isbn = {978-1-4799-7792-5},
}