An integrated temperature-cycling acceleration and test technique for 3D stacked ICs

Nima Aghaee, Zebo Peng, Petru Eles. An integrated temperature-cycling acceleration and test technique for 3D stacked ICs. In The 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015, Chiba, Japan, January 19-22, 2015. pages 526-531, IEEE, 2015. [doi]

Abstract

Abstract is missing.