Anthony Agnesina, Moritz Brunion, Jinwoo Kim, Alberto García Ortiz, Dragomir Milojevic, Francky Catthoor, Manu Perumkunnil, Sung Kyu Lim. Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs. In IEEE/ACM International Symposium on Low Power Electronics and Design, ISLPED 2021, Boston, MA, USA, July 26-28, 2021. pages 1-6, IEEE, 2021. [doi]
Abstract is missing.