Aditya Agrawal, Josep Torrellas, Sachin Idgunji. Xylem: enhancing vertical thermal conduction in 3D processor-memory stacks. In Hillery C. Hunter, Jaime Moreno, Joel S. Emer, Daniel Sánchez 0003, editors, Proceedings of the 50th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2017, Cambridge, MA, USA, October 14-18, 2017. pages 546-559, ACM, 2017. [doi]
@inproceedings{AgrawalTI17,
title = {Xylem: enhancing vertical thermal conduction in 3D processor-memory stacks},
author = {Aditya Agrawal and Josep Torrellas and Sachin Idgunji},
year = {2017},
doi = {10.1145/3123939.3124547},
url = {http://doi.acm.org/10.1145/3123939.3124547},
researchr = {https://researchr.org/publication/AgrawalTI17},
cites = {0},
citedby = {0},
pages = {546-559},
booktitle = {Proceedings of the 50th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2017, Cambridge, MA, USA, October 14-18, 2017},
editor = {Hillery C. Hunter and Jaime Moreno and Joel S. Emer and Daniel Sánchez 0003},
publisher = {ACM},
isbn = {978-1-4503-4952-9},
}