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TSVs in early layout design exploration for 3D ICs

Mohammad A. Ahmed, Malgorzata Chrzanowska-Jeske. TSVs in early layout design exploration for 3D ICs. In IEEE 5th Latin American Symposium on Circuits and Systems, LASCAS 2014, Santiago, Chile, February 25-28, 2014. pages 1-4, IEEE, 2014. [doi]

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