JungChak Ahn, Kyungho Lee, Yitae Kim, Heegeun Jeong, Bumsuk Kim, Hongki Kim, JongEun Park, Taesub Jung, Wonje Park, Taeheon Lee, Eunkyung Park, Sangjun Choi, Gyehun Choi, Haeyong Park, Yujung Choi, Seungwook Lee, Yunkyung Kim, Y. J. Jung, Donghyuk Park, Seungjoo Nah, Youngsun Oh, Mihye Kim, Yooseung Lee, Youngwoo Chung, Ihara Hisanori, Joon-Hyuk Im, Daniel-K J Lee, Byunghyun Yim, GiDoo Lee, Heesang Kown, Sungho Choi, Jeonsook Lee, Dongyoung Jang, Youngchan Kim, Tae-Chan Kim, Hiroshige Goto, Chi-young Choi, Duckhyung Lee, Gab-soo Han. 7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate. In 2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014. pages 124-125, IEEE, 2014. [doi]
@inproceedings{AhnLKJKKPJPLPCC14,
title = {7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate},
author = {JungChak Ahn and Kyungho Lee and Yitae Kim and Heegeun Jeong and Bumsuk Kim and Hongki Kim and JongEun Park and Taesub Jung and Wonje Park and Taeheon Lee and Eunkyung Park and Sangjun Choi and Gyehun Choi and Haeyong Park and Yujung Choi and Seungwook Lee and Yunkyung Kim and Y. J. Jung and Donghyuk Park and Seungjoo Nah and Youngsun Oh and Mihye Kim and Yooseung Lee and Youngwoo Chung and Ihara Hisanori and Joon-Hyuk Im and Daniel-K J Lee and Byunghyun Yim and GiDoo Lee and Heesang Kown and Sungho Choi and Jeonsook Lee and Dongyoung Jang and Youngchan Kim and Tae-Chan Kim and Hiroshige Goto and Chi-young Choi and Duckhyung Lee and Gab-soo Han},
year = {2014},
doi = {10.1109/ISSCC.2014.6757365},
url = {https://doi.org/10.1109/ISSCC.2014.6757365},
researchr = {https://researchr.org/publication/AhnLKJKKPJPLPCC14},
cites = {0},
citedby = {0},
pages = {124-125},
booktitle = {2014 IEEE International Conference on Solid-State Circuits Conference, ISSCC 2014, Digest of Technical Papers, San Francisco, CA, USA, February 9-13, 2014},
publisher = {IEEE},
isbn = {978-1-4799-0918-6},
}