A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants - researchr publication authors

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Omer Can Akgun, Kambiz Nanbakhsh, Vasiliki Giagka, Wouter A. Serdijn. A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants. In 2019 IEEE Biomedical Circuits and Systems Conference, BioCAS 2019, Nara, Japan, October 17-19, 2019. pages 1-4, IEEE, 2019. [doi]

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