Omer Can Akgun, Kambiz Nanbakhsh, Vasiliki Giagka, Wouter A. Serdijn. A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants. In 2019 IEEE Biomedical Circuits and Systems Conference, BioCAS 2019, Nara, Japan, October 17-19, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{AkgunNGS19,
title = {A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance Within Active Flexible Implants},
author = {Omer Can Akgun and Kambiz Nanbakhsh and Vasiliki Giagka and Wouter A. Serdijn},
year = {2019},
doi = {10.1109/BIOCAS.2019.8919203},
url = {https://doi.org/10.1109/BIOCAS.2019.8919203},
researchr = {https://researchr.org/publication/AkgunNGS19},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2019 IEEE Biomedical Circuits and Systems Conference, BioCAS 2019, Nara, Japan, October 17-19, 2019},
publisher = {IEEE},
isbn = {978-1-5090-0617-5},
}