S. Akiyama, T. Baba, M. Imai, M. Mori, T. Usuki. High-performance silicon modulator for integrated transceivers fabricated on 300-mm wafer. In The European Conference on Optical Communication, ECOC 2014, Cannes, France, September 21-25, 2014. pages 1-3, IEEE, 2014. [doi]
@inproceedings{AkiyamaBIMU14,
title = {High-performance silicon modulator for integrated transceivers fabricated on 300-mm wafer},
author = {S. Akiyama and T. Baba and M. Imai and M. Mori and T. Usuki},
year = {2014},
doi = {10.1109/ECOC.2014.6963947},
url = {https://doi.org/10.1109/ECOC.2014.6963947},
researchr = {https://researchr.org/publication/AkiyamaBIMU14},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {The European Conference on Optical Communication, ECOC 2014, Cannes, France, September 21-25, 2014},
publisher = {IEEE},
}