Reliability study of the electroless Ni-P layer against solder alloy

M. O. Alam, Y. C. Chan, K. C. Hung. Reliability study of the electroless Ni-P layer against solder alloy. Microelectronics Reliability, 42(7):1065-1073, 2002. [doi]

Authors

M. O. Alam

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Y. C. Chan

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K. C. Hung

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