M. O. Alam, Y. C. Chan, K. C. Hung. Reliability study of the electroless Ni-P layer against solder alloy. Microelectronics Reliability, 42(7):1065-1073, 2002. [doi]
@article{AlamCH02,
title = {Reliability study of the electroless Ni-P layer against solder alloy},
author = {M. O. Alam and Y. C. Chan and K. C. Hung},
year = {2002},
doi = {10.1016/S0026-2714(02)00068-9},
url = {http://dx.doi.org/10.1016/S0026-2714(02)00068-9},
tags = {C++, reliability},
researchr = {https://researchr.org/publication/AlamCH02},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {42},
number = {7},
pages = {1065-1073},
}