Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology - researchr publication authors

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Syed M. Alam, Robert E. Jones, Scott Pozder, Ankur Jain. Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology. In 10th International Symposium on Quality of Electronic Design (ISQED 2009), 16-18 March 2009, San Jose, CA, USA. pages 569-575, IEEE, 2009. [doi]

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