Bakhtiar Ali, Mohd Faizul Mohd Sabri, Suhana Binti Mohd Said, Nazatul Liana Sukiman, Iswadi Jauhari, Mohammad Hossein Mahdavifard. Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectronics Reliability, 82:171-178, 2018. [doi]
@article{AliSSSJM18,
title = {Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment},
author = {Bakhtiar Ali and Mohd Faizul Mohd Sabri and Suhana Binti Mohd Said and Nazatul Liana Sukiman and Iswadi Jauhari and Mohammad Hossein Mahdavifard},
year = {2018},
doi = {10.1016/j.microrel.2018.01.015},
url = {https://doi.org/10.1016/j.microrel.2018.01.015},
researchr = {https://researchr.org/publication/AliSSSJM18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {82},
pages = {171-178},
}