Bakhtiar Ali, Mohd Faizul Mohd Sabri, Suhana Binti Mohd Said, Nazatul Liana Sukiman, Iswadi Jauhari, Mohammad Hossein Mahdavifard. Microstructural and tensile properties of Fe and Bi added Sn-1Ag-0.5Cu solder alloy under high temperature environment. Microelectronics Reliability, 82:171-178, 2018. [doi]
Abstract is missing.