Kareem Ali, Eslam Yahya, Alaa El Rouby, Yehea Ismail. Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays. In 5th International Conference on Energy Aware Computing Systems & Applications, ICEAC 2015, Cairo, Egypt, March 24-26, 2015. pages 1-4, IEEE, 2015. [doi]
Abstract is missing.