Takeru Amano, Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, S. Suda, T. Kurosu, Koichi Takemura, T. Aoki, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi. Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate. In Optical Fiber Communications Conference and Exhibition, OFC 2021, San Francisco, CA, USA, June 6-10, 2021. pages 1-3, IEEE, 2021. [doi]
Abstract is missing.