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Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints

C. Andersson, D. R. Andersson, P. E. Tegehall, Johan Liu. Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. Microelectronics Reliability, 47(2-3):266-272, 2007. [doi]

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C. Andersson

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D. R. Andersson

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P. E. Tegehall

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Johan Liu

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